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To Download CPZ37R Datasheet File

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  Datasheet File OCR Text:
  geometry principal device type ctltvs12 gross die per 5 inch wafer 368,512 process CPZ37R transient voltage suppressor 12 volt tvs chip process details die size 6.7 x 6.7 mils die thickness 3.54 mils anode bonding pad area 4.3 x 4.3 mils top side metalization al - 13,000? back side metalization au-as/ag - 13,000?/6,000? www.centralsemi.com r0 (16-march 2012)


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